Orienting Silicon Integrated Circuit Chips for Lead Bonding
| dc.date.accessioned | 2004-10-01T20:37:25Z | |
| dc.date.accessioned | 2018-11-24T10:10:39Z | |
| dc.date.available | 2004-10-01T20:37:25Z | |
| dc.date.available | 2018-11-24T10:10:39Z | |
| dc.date.issued | 1975-01-01 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1721.1/5799 | |
| dc.identifier.uri | http://repository.aust.edu.ng/xmlui/handle/1721.1/5799 | |
| dc.description.abstract | Will computers that see and understand what they see revolutionize industry by automating the part orientation and part inspection processes? There are two obstacles: the expense of computin and our feeble understanding of images. We believe these obstacles are fast ending. To illustrate what can be done we describe a working program that visually determines the position and orientation of silicon chips used in integrated circuits. | en_US |
| dc.format.extent | 16 p. | en_US |
| dc.format.extent | 1432189 bytes | |
| dc.format.extent | 1027623 bytes | |
| dc.language.iso | en_US | |
| dc.title | Orienting Silicon Integrated Circuit Chips for Lead Bonding | en_US |
Files in this item
| Files | Size | Format | View |
|---|---|---|---|
| AIM-323.pdf | 1.027Mb | application/pdf | View/ |
| AIM-323.ps | 1.432Mb | application/postscript | View/ |