Effect of Pressure on the Performance of Organic Light Emitting Devices Fabricated by Cold Welding
Analytical and finite element models were used to simulate additive cold welding patterning processes. The effects of adhesion, pressure, thin film (layer) thickness and dust particle modulus (between the contacting surfaces) are examined. A simple model is developed and used to determine the contact profiles around impurities between cold-welded thin films. These are computed as a function of adhesion, particle modulus, and layer thickness. The models are shown to provide new insights into the significance of adhesion, layer thickness and particle modulus in the surface contacts that occur during cold welding. The implications of the results are then discussed for the design and fabrication organic electronics via cold welding.